COMMITTED TO QUALITY
Our team remains vigilant, determined, and committed to upholding the highest level of service and quality of products to our customers. Our goal of generating an unequivocal level of trust from our customers is why K-1 continues to measure, monitor, and improve our processes. Providing a level of trust to our customers that they can rely upon remains our top priority. Maintaining a robust distribution system that is built on trust, quality, and integrity remains the focal point of our unwavering drive to compassionately, consistently, and cohesively move forward productively and proactively. Heightening our capabilities by initiating top-tier inspection efforts is how we continue to uphold our commitments. Quality control processes coupled with advanced counterfeit detection protocol ensure our commitments are not only upheld but maintained over time. All incoming product undergoes a variety of inspection and testing to ensure each piece is 100% in accordance with manufacturer specifications and reliable for their application. This process is key in combating the probability of risk and ineffectiveness that could cause a critical defect in the customer’s product or process. In addition, we want to ensure adequate testing and inspection with the goal of zero defects so that the customer can receive their product “dock to stock”. This will in turn provide the best possible customer experience and minimize or eliminate any inspection and/or rework costs in their process as well. Outlining our objective to maintain a vigorous inspection process is imperative, however, defining each process and each piece of equipment is vital.
How We Test
External Visual Inspection is a non-destructive method that, when performed correctly, has a high success rate in identifying suspect or fraudulent/counterfeit parts. Many fraudulent or counterfeit parts are recycled, meaning they are taken from boards or assemblies and subjected to various modifications to deceive buyers. These modifications can include straightening and re-tinning the leads, sanding off the original markings, applying blacktopping to conceal sanding marks, and then remarking the part.
External Visual Inspection consists of two examinations:
General Criteria Examination: This examination ensures that all parts in the lot meet the general criteria specified in the AS6081 test standard. It involves visually inspecting the parts with the naked eye to ensure they are in good condition and meet the standard requirements.
Detailed Criteria Examination: Samples from the lot are selected for a more thorough examination based on the detailed criteria specified in the AS6081 test standard. Whenever possible, the sample being inspected should be compared to a part received directly from the Original Component Manufacturer (OCM) or an OCM-approved authorized distributor. The samples are optically examined at an appropriate level of magnification and lighting to detect specific features. Anomalies found during this examination can be indicative of suspect counterfeit parts.
Microscopy provides a solution for inspection, Quality Control, and electronics failure analysis. Digital microscopy can help make quality control and assurance, failure analysis, and research and development of electronic parts and components reliable and efficient. Precise analysis, including comparison with reference images and standards, as well as efficient and consistent documentation is necessary. High resolution, large depth of field for 3D perception, a long working distance, capability to visualize fine details must all be consistent in order to obtain the proper analysis and documentation results.
The solvent exposure test is conducted to assess the ability of a device to withstand exposure to solvents without experiencing mechanical, electrical, or material damage. This test specifically focuses on validating the ink-printed markings and the physical surface of a component when exposed to various liquid solvents.
During the test, the device is typically subjected to different solvents that are commonly encountered in its intended environment or during typical handling and use. These solvents may include substances such as isopropyl alcohol, acetone, or other cleaning agents. The goal is to determine whether the solvents cause any adverse effects on the device.
The ink-printed markings on the component are examined to ensure that the solvents do not cause the ink to smear, fade, or become illegible. This validation is important as accurate and readable markings are essential for proper identification and traceability of the component.
Additionally, the physical surface of the component is inspected to verify that it remains intact and free from any damage or deterioration caused by the solvents. This includes assessing for any changes in texture, discoloration, swelling, or other signs of material degradation.
By subjecting the device to solvent exposure and carefully evaluating its effects on the ink-printed markings and physical surface, the test helps ensure the device’s reliability and suitability for its intended application. It provides valuable information for manufacturers, users, and quality control personnel regarding the device’s resistance to solvent-related damage and its overall durability.
X-ray inspection is a non-destructive test used to verify bond wire connections, compare die sizes, and detect electrode-static discharge (ESD) damage. Global Electronics Testing Services typically checks 5 samples or the entire lot, depending on customer requirements. Counterfeit devices can be identified by comparing the die structure to that of a known good device. The X-ray inspection is conducted in accordance with AS5553 and MIL-STD-883 2012.7.
X-ray inspection is an important step in counterfeit avoidance and can detect various issues such as broken bond wires, ESD and EOS damage, voids, die size discrepancies, die shape irregularities, incorrect bond wire placement, lead design problems, canted die, and can also perform comparative analysis. This test helps ensure the integrity and authenticity of electronic components.
The purpose of XRF Analysis is to evaluate the material composition of the terminations and the molding compound in order to detect the presence of Pb and other discrepancies with an authentic part. This test is non-destructive. The test provides a complete graph with a list of substances found. The EU RoHS Directive restricts the maximum allowable levels of lead (Pb), cadmium (Cd), mercury (Hg), hexavalent chromium (Cr6+), polybrominated biphenyl (PBB) and polybrominated diphenyl ether (PBDE) flame retardants to 0.1% or 1000ppm (except for cadmium, which is limited to 0.01% or 100 ppm) by weight of homogeneous material in electrical equipment and electronic products.
Decapsulation inspection is a destructive test that involves verifying the correct manufacturer’s die. It is performed by using a mixture of fuming Nitric acid and fuming Sulfuric acid, heated to a specific temperature, to etch away the polymer encapsulants or the exterior of a device. This process is carried out using a Nisene Technologies Jetetch Pro decapsulation machine. By creating a cavity in the device, it exposes the bonding wires, internal structure, and the die.
Decapsulation is used to reveal the internal structure of an integrated circuit. The process etches away the polymer encapsulants or the exterior of the device. Exposing a cavity within the device, exposing the bonding wires, internal structure, and the die. Once the manufacturer’s logo and markings are uncovered, they are compared to a database of known good parts.
Moisture sensitive levels combined with proper packaging in accordance to manufacturer specifications is critical. Improper packaging can cause immeasurable damage to the end-user. Baking and dry packing are important processes in manufacturing that help to improve the quality and durability of products, as well as protect them from environmental factors that could cause damage or deterioration. Popcorning, as an example, may occur when a part is exposed to high temperatures associated with the soldering process, when product is improperly packaged. Baking and dry-pack can eliminate these problems. Moisture-induced interface delamination begins with the package absorbing moisture from the environment, which condenses in micropores in polymer materials such as the substrate, die-attach and molding compound.